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| PREPARED BY: JJ&,~ APPROVED BY: DATE: -2 ; DATE: / / 97 s-a ii -I -y--------. 3 _._ 1`I&j&,,_-.-: .: :-: fi :,.-- ;:,+;SPEC.No. a PALa -_ ti~~~t34-. ELECTROMC COMPONENTS GROUP SHARP CORPORATION REPRESENTATIVE DMSION: SPECIFICATION DEVICE SPECIFICATION FOR Opto-Electronic Devices Division Light Emitting Diode MODEL No. LTlED9OA 1. These specification sheets include materials protected under the copyright of Sharp Corporation ("Sharp"). Please do not reproduce or cause anyone to reproduce them without Sharp's consent. 2. When using this produ& please observe the absolute maximm ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damageresuking from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This products is designed for use in the following application areas; r * OA equipment * Audio visual equipment * Home appliance * Measuring equipment * Telecommunication equipment (Terminal) * Computers * Tooling machines If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3). please be sure to observe the precautions given in those respective paragraphs. L 1 (2) Appropriate measures, such as W-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in fimction and precision, such as ; r * Transportation control and safety equipment (aircra& train, automobile etc.) * Rescue and security equipment * Tra& signals * Gas leakage sensor breakers 1 * Other safety equipment (3) Please do not use this product for equipment which require extremely high reliability and safety in fLnction and precision, such as ; r * Space equipment * Telecommunication equipment (for trunk lines) l Medical equipment L * Nuclear power control equipment (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult ,tith a Sharp sales representative for any questions about this product. DATE: PRESENTED BY. 4 AC. Al . &,I 1 I /J / f7yy CUSTOMER'S APPROVAL DATE: BY: M.Katoh, Department General iManager of Engineering Dept.,111 Opto-Electronic Devices Division Electronic Components Group SHARP CORPORXTION LTlEDSOA Srxcifmtion 1. Application This specification applies to the light emitting diode device Model No. LTlEDSOA. [GaPCienow-green)tG~/G~~ed)chip LED device] 2. Outline dimensions and terminal connections . . . . . . . . . . . ..-.........Refertothe attached sheet Page 2. 3. Ratings and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 3 -6. 3-1. Absolute maximum ratings 3-2. Electra-optical characteristics 3-3. Derating Curve 3-4. Yellow-green Characteristics Diagram 3-5. Red Characteristics Diagram 4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 7. 4- 1. Test items and test conditions 4-2. Failure judgement criteria -, 5. lncoeg inspection . . . . . . . . . . . . . . . . . . . . ..*....................... Refer to the attached sheet Page 8. ,-. 1. . \ 5- 1. Inspection method 5-2. Des-cription of inspection and criteria 6. Taping specikation . . . . . . . . . . . . . . . . . . . . . . ..*....................* 6-1. Taping 6-2. Packing specification 6-3. Label 6-4. Luminous intensity rank 7. Soldering.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*................ 7-1. Reflow soldering * precautions foruse............................................... S- 1. Precautions matters for designing circuit 8-2, Cleaning method 9. Enhamenp.. . . . . . . . . *......................................... Refer to thy attached sheet Page 13. Refer to the attached sheet Page 13. Refer to the attached sheet Page 9- 11. ,.: ,:`..; >Refer to the attached sheet Page 12. 9- 1. Ozonosphere destructive chemicals. 9-2. Bromic non-burning materials 2. outline dimensions and terminal c~~ecfio~ Torminrl connoctlon 4 Material Glass-Epoxy PWB: Resin: Epoxy Finish Au Plated DrawingNo. 51112009 3. Ratings aad characteristics (Notel) Duty ratio=I/1O,Pulse width=O.Ims , (Note2) &lamal soldering Max& (Note3) Each dissipation value of diode(Yellow-green,Red) is their own ratings ar generatings independently and the dissipation at the time when both diodes simultaneously generating should be within the half. Red unit MIN. 1I-YIP. IMAX. - I 2.0 I 2.8 I v (Note 3)Measure.d by SHARP EG&G MODEL550(Radiometer/Photometersyste (Tolerance : t 15%) i ---.- -.__ DG-992004 D&3/99 *--._____ 3-3. D&g Curve(Yellow-green Red) and Fotward Current DentingCurve PeakForward CurentDemtingCurve -25 0 25 50 7585100 125 0 25 50 75g5100 125 Ambient Temperature Ta("c) Ambient Temperature Tfl) Peak Forward Current Duty Ratio vs. (Ta=25"C) DuryRAo . -- -.-____ `y--. -. r -.-_-_ _ _ D6- 992004 Deem99 .LTlEDSOA %34. Yellow-greenChamcteristi~~ Diagram(typ)(Note 1) . ' . ---- -- *- *> - Fomard Current vs.Fomard Volee Relative Luminous Intensity vs. Ambient Tapm=2omw 1000 g 2 z 2 2 .-B E 3 : .9 100 (Ta=25"C) 0. 1 1 1.2 1.4 1.6 d 1.8 2 2.2 2.4 Forward Voltage VF(v) 10 -60 -40 -20 0 20 40 60 80 100 120 Ambient Temprat~~~~ Ta("C) I / iii/iii/ i 0. 1 1 10 100 Forward Current IF(mA) tteed data. (Note 1) Above characteristicdataaretypical dataandnot a ,guaran DG-992004 D&/99 3-5. Red Chamctetistics Diagam(typ) (Note 1) Forward Current vnForward Voltage Relative Luminous Intensity vs. Ambient Temperature aF=2omA~ 1000 c b z B Y 5 100 a .B E 3 0 .z P 2 10 100 0. 1 1 1.2 1.4 1.6 1.8 2 2.2 2.4 l -60 -40 -20 0 20 40 60 80 100 120 Forward Voltage VF(v) Ambient Tmpraxure Ta("cI 0. 1 1 Forward CummtE=(mA) 10 100 (Note 1) Above characteristic data are typical data and not a gmantteed dam r 4. Reliability The reliability of products shallbe satisfiedwith itemslistedbelow. 4-l. Test itemsandtestconditions Testitems temperature cycling Test conditions -25"c(3Omin)-+lOO"c(3Omin),3Otimes Cotidence level: 90% Samples (Il) LTPD Defective (C) (%) n=32, c=o n-22, c=o 10 10 10 10 10 20 20 20 High temp.andhigh Ta=+60"C,9O%RH,HOOh humidity storage figh E mpe&ure storage Ta= 1OO"C,t+OOh n=22, c=o n=", c=o n=22, Go n=ll, C=O n=ll, C=O n=ll, c=O I .ow temperature storageTa=25"C,t=SOOh Ta=25"C,1,=30mA,r500h , Operatingtest Mechanicalshock Variable titquency 15 ooom/s',osms, 3times kX$Y,*Z direction / 2OOm/s*, 100-2 OOO-lOOHz/sweepfor 4min. ,4timeaYz direction Referto the attachedsheq Page1l/12 ltimes ViilY3tiOil Solderingheat 4-2. Failureju&ement criteria * 1 Parameter Forward voltage Reverse current Luminousintensity Symbol vF Failurejudgement criteria *2 v, > U.S.L. x 1.2 IR Ia > U.S.L. x 2.0 Iv > The first stagevalueX 2.0 or The tit stagevalueX 0.5 > Iv IV * 1: Measuringconditionis in accordance with specification. *2: U.S.L. is shown Upper SpecificationLimit. by 5. Incoming inspection .5- 1. Inspection method A single sampling plan, normal inspection level S-4 based on IS0 2859-l shah be adopted J-L. u~b,Ipu"l.l "I uqJ'.*LA"Y LIYY VA-.-- FIO. Inspection items Electra-optical .. Charactenstlcs Criteria Not radiation Not correct Product inserted in reverse direction Model number is not printed,or misprinted Plating abnormality observed over 50% or greater percentage * 1 Not conforming to the specification Not conforming to the specification Dust Defect A@ 1 2 3 4 5 6 7 8 Radiation color Taping Label Solderbility 1 Electra-optical Characteristics Major defect 0.1% Outline dimensions : @0.8nun or more I' Thread dust : 2.5mm or more in length and 0.25mm or more in width Air bubbles : 4 0.8mm or more Scratch : 2.5n.u.nor more in length and 025mm or more in width However&e product is qualified as a good unit if the -scrach does not touch the Auwire.when seen from the front. Resin batr : Effect to the specification Resin flash:Over the unspecified tolerance Resin ond plated crack :0.3mm or more 9 could solder 50% or greater and less than 90% out of judgement area * 1 Judgement area The plated area of the product bottom Solderbility 2 Minor defect 0.4% _. __ _ DG- 992004 : I-MODELNo. i :`-: .a LTlEDSOA -------Ad 6.Taping specificarion 6-l.Taping 6-1-l.Shape and dime&on of tape(lYF'.) De&/99 P&G< - 5 &I? `:-.a _ 2' .& & 6-l-2.Shape and dimension of reel(TYP.) DG-992004 Deem99 MbDEL No. z LTlEDSOA j 3 4--.I `. PAGE ' -IQ8443 6-l-3 .Tapingspecification (1) Leadtape: . End 000000 0000000000 Pull ,,,I--> __ Begirming q ICIU~ Empty -I- q mnn Stuffed A' 10 Empty pitch 170 I-Leading or `more 40-50 pitch (2) Cover tapestrengthagainst peeling:P=O.l-O8N( 0 =lO'or less) Cover tape c `yape speed : Smm/s (3) Tapestrengthagainst bending: The radiusof bendingcircle shouldbe 3Omm more. or Ifit is less than 3Omm, cover may peel. the There shouldnot bejoint of covertape or carrier tape. (4) Jointingof tape: Average 3,OOOpcs. reel per (5) Quantity per reel: Average 0.02g 1product (6) Massper products: Average 150gI packing (7)Massper packing: @ Thereshouldnot be missingabovecontinuous three products. (8) Others: @ Productsshouldbe easilytakenout @ Productsshouldnot be attachedto the cover tapeat peeling. 6-2. Packingspecification 6-2-1. Dampproofpackage In otherto avoid the absorption humidity in transportandstorage,the devices arepacked of in aluminum sleeve. Lab.31 6-2-2.Strage conditions Temperature: 5 to 30C Humidity : lessthan 6O%RH 6-2-3.Trement after opening (1) Please makea soldering within 15days after openingunderfollowing condition; Temperature 5 to 30C Humidity : lessthan6O%RH : (2) In case devicesare not usedfor a long tune after opening,the storagein dry box is recommendable. the Or it is better to repackthe deviceswith a desiccative the sealer put them in the somestorage by and conditions as6-2-2. Then they shouldbe usedwithin 2 weeks. (3) Please makea solderingafter a follewing bakingtreatmentif unused term shouldbe over the conditionsof (2) *Recommendable conditions: 0 in taping Temprature:6O'C to 6Y'C,Time:j6 to 38 hours 0 in individual (on PWB or metallic tray) Tempnture: IOO'C to 13Oc .Time:Z to 3 hours 6-3. Label _ I LOT No.KA99B19 + Model number - Qmtity of products +-EIkTG3Barcode + EL4J C-3 Bar code + Lot numberl and Luminous rank, dominantwavelengthrank + Reduction country . @ Prodwtion plant code@0 indicatedalphabetically) be @ Roduetionlot(singleor doublefigures) @ Year of production(tbelasttwo figuresof theyear) @ Month of production (to be indicatedalphabeticallywith Januarycorresponding A) to @ Date of production(0l-3 1) 1 6-4.Luninous intensity rank(Note 1) (Yeiiow-green) . Luminousintensity 33.8 B 173 C unit mcd (Ta=25"C) condition I&!OmA D 25.0 36.0 - 48.8 (70.2) CRe4 . A B C D Dominantwavelength 6.0 - (Tolerance : + 15%) (Ta=25"C) Unit Condition 11.8 17.0 24.6 (35.5) Ml IpZOmA 8.8 12.7 18.3 - (Tolerance: F 15%) Also I shaIlnot askthe delivery ratio of eachrank. (Note 1) (Note 2) This rank value is the setting value of whenthat classifies the rank and be not a guaranteevalue. it z-*, a_ ,-.> i'- *> *.7; . J J -`Q ,y * I ----__c:. - DG - 992004 :.-- -- MODEL No. -my i ;-.. .,--. -LTIEDSOA . -.- 1 DedY99 PAGE _ l2/13 --.-. .,-> `2X4 : -. .___ 7. Soldering 7; 1.Reflow soldering (1) It is not recommended exceedthe soldering to temperature time shownbelow. and Caused substrate by bend or the othermechanical stress duringreflow soldering may happen gold wire disconnection Thereforeplease etc. checkandstudyyour solderreflow machine's bestcondition. (2) Reflow soldering temperatureprofile to be doneunderthe following condition. 140-160 g Time(s) Recommendable Thermal Model (3) Recommendable Metal ~Mask patternfor screen print Recommend 0.3m.m 0.5~1 thickness to metalmask for screen print Caused solderreflow $ondition, by solderpaste, substrate the othermaterialetc., and may changesolderbility. Please check andstudy actual solderbilitybefore usage. *Center of the moduct 1 1.2 1 llO/ rRecommended 1.24 -r- soldar pattern (Unir:mxn) i--.._ i J.= J `.--.' i i i _ DGi-,J 992004 1 Dee/3/99 ,v+""-4 y= T;TlEDgOi L L:i ~ - . . _. : . 8. Recautions for use 8- 1. &cautions matters for designing circuit This product is not designed as electromagnetic and ionized-particle radiation resistant 8-2. Cleaning method Use only the following types of solvent.%ater" Recommend conditions: RT. 4OkHz, 3OW/l, time is more than 3 minutes The alkt on the device f?om ultrasonic bath, ultrasonic output, duration, board size and device mounting method. Test the cleaning method under actual conditions and check for abnormalities before actual use. 9. Environment 9- 1. Ozonosphere destructive chemicals. (1) The device doesn't contain following substance. (2) The device doesn't have a production line whose process requires following substance. Restricted part: CFCs,halones,CC~,Trichloroetbane(Methychloroform) I 9-2. Bromic non-bum& materials The device doesn't contain bromic non-burning materials(PBBOs,PBBs) . LT1ED90A |
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